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  power transistors 1 publication date: april 2003 sjd00178bed 2SD1262, 2SD1262a silicon npn triple diffusion planar type darlington for midium speed power switching complementary to 2sb0939, 2sb0939a features ? high forward current transfer ratio h fe ? high-speed switching ? n type package enabling direct soldering of the radiating fin to the printed circuit board, etc. of small electronic equipment. absolute maximum ratings t c = 25 c electrical characteristics t c = 25 c 3 c unit: mm note) 1. measuring methods are based on japanese industrial standard jis c 7030 measuring methods for transistors. 2. * : rank classification parameter symbol rating unit collector-base voltage 2SD1262 v cbo 60 v (emitter open) 2SD1262a 80 collector-emitter voltage 2SD1262 v ceo 60 v (base open) 2SD1262a 80 emitter-base voltage (collector open) v ebo 7v collector current i c 8a peak collector current i cp 12 a collector power dissipation p c 45 w t a = 25 c 1.3 junction temperature t j 150 c storage temperature t stg ? 55 to + 150 c parameter symbol conditions min typ max unit collector-emitter voltage 2SD1262 v ceo i c = 30 ma, i b = 0 60 v (base open) 2SD1262a 80 collector-base cutoff 2SD1262 i cbo v cb = 60 v, i e = 0 100 a current (emitter open) 2SD1262a v cb = 8 0 v, i e = 0 100 emitter-base cutoff current (collector open) i ebo v eb = 7 v, i c = 0 2 ma forward current transfer ratio h fe1 * v ce = 3 v, i c = 4 a1 000 10 000 ? h fe2 v ce = 3 v, i c = 8 a 500 collector-emitter saturation voltage v ce(sat) i c = 4 a, i b = 8 ma 1.5 v base-emitter saturation voltage v be(sat) i c = 4 a, i b = 8 ma 2.0 v transition frequency f t v ce = 10 v, i c = 0.5 a, f = 1 mhz 20 mhz turn-on time t on i c = 4 a 0.5 s strage time t stg i b1 = 8 ma, i b2 = ? 8 ma 4.0 s fall time t f v cc = 50 v 1.0 s 8.5 0.2 3.4 0.3 1.0 0.1 0 to 0.4 6.0 0.2 0.8 0.1 r = 0.5 r = 0.5 1.0 0.1 0.4 0.1 (8.5) (6.5) (6.0) 1.3 (1.5) (7.6) 2.54 0.3 1.4 0.1 5.08 0.5 123 1.5 0.1 2.0 0.5 10.0 0.3 1.5 +0 ?0.4 3.0 +0.4 ?0.2 4.4 0.5 4.4 0.5 14.4 0.5 rank r q p h fe1 1 000 to 2500 2 0 00 to 5 000 4 000 to 10 000 1: base 2: collector 3: emitter n-g1 package note) self-supported type package is also prepared. b c e internal connection
2SD1262, 2SD1262a 2 sjd00178bed v ce(sat) ? i c v be(sat) ? i c h fe ? i c p c ? t a i c ? v ce v ce(sat) ? i c 0 160 40 120 80 0 10 20 30 40 50 collector power dissipation p c (w) ambient temperature t a ( c) (1)t c =ta (2)with a 50 50 2mm al heat sink (3)without heat sink (p c =1.3w) (1) (2) (3) 0 05 12 4 3 12 10 8 6 4 2 collector current i c (a) collector-emitter voltage v ce (v) i b =4.0ma t c =25?c 3.5ma 3.0ma 2.5ma 2.0ma 1.5ma 1.0ma 0.5ma 10 1 0.1 0.01 0.1 1 10 collector-emitter saturation voltage v ce(sat) (v) collector current i c (a) (1) i c /i b =250 (2) i c /i b =500 (3) i c /i b =1000 t c =25?c (3) (1) (2) 10 1 0.1 0.01 0.1 1 10 collector-emitter saturation voltage v ce(sat) (v) collector current i c (a) i c /i b =500 t c =100?c 25?c ?5?c 0.1 10 1 0.01 0.1 1 10 base-emitter saturation voltage v be(sat) (v) collector current i c (a) i c /i b =500 25?c 100?c t c =?5?c 0.1 1 10 100 10 10 2 10 3 10 4 10 5 forward current transfer ratio h fe collector current i c (a) v ce =3v 25?c ?5?c t c =100?c 0.01 1 0.1 1 10 100 10 100 1 000 collector current i c (a) collector-emitter voltage v ce (v) non repetitive pulse t c =25?c i cp i c t=10ms t=300ms t=1ms 2SD1262 2SD1262a safe operation area r th ? t 1 10 ? 2 10 ? 1 10 10 3 10 2 10 3 10 4 10 2 10 1 10 ? 1 10 ? 3 10 ? 2 10 ? 4 time t (s) thermal resistance r th ( c/w) (1) (2) (1)without heat sink (2)with a 50 50 2mm al heat sink
request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese government if any of the products or technologies described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative characteris- tics and applied circuits examples of the products. it neither warrants non-infringement of intellec- tual property right or any other rights owned by our company or a third party, nor grants any license. (3) we are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) the products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instru- ments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (5) the products and product specifications described in this material are subject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (6) when designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage, and heat radiation characteristics. other- wise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) when using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) this material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. 2002 jul


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